Scaling Up Productivity: How DJPACK’s Double Chamber Vacuum Packaging Machine Delivers Results

The “dead time” during the vacuum and sealing process created a bottleneck that trickled down the entire production line. However, the transition to a Double Chamber Vacuum Packaging Machine ...
Semiconductor Engineering

Smarter Packaging: How AI is Reshaping Assembly and Materials Control

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...
Silicon Semiconductor

When mechanics become yield-critical: motion design for the advanced packaging era

Advanced packaging has created new process bottlenecks related to the internal mechanics of the packaging equipment. As ...
EDN

Advancing MEMS packaging, assembly, and test for the marketplace

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...